Photonic Packaging Engineer

Location New Providence
Discipline: Hardware Acceleration Jobs
Job type: Permanent
Salary: US$180000 - US$220000 per annum + Equity
Contact name: Luke Tomaszko

Contact email:
Job ref: BBBH9275_1684272090
Published: 16 days ago
Startdate: 06/12/2023

Acceler8 Talent is seeking an experienced photonic packaging engineer to join a well funded start-up that is poised to deliver the world's most efficient optical interconnects, designed from the ground up for AI workloads.

Their cutting-edge technology enables the world's highest density and lowest power photonic interconnects, transforming how data is processed and transmitted in data center environments.

Backed by Tier 1 investors, they are seeking top talent to join their world-class team and drive the future of optical communications.


  • Bachelor's or Master's degree in Electrical Engineering, Optics, Photonics, or a related field
  • 5+ years hands on experience with IC package design experience
  • Strong expertise in packaging processes, methodologies, and tools.
  • Thorough understanding of signal and power integrity fundamentals
  • Experience with Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS
  • Experience in package design electrical review, SI/PI analysis

They are offering a competitive base salary + a generous equity package and looking to get someone started ASAP, with interviews on going.

Please apply here or contact me at to hear more.