Acceler8 Talent is seeking a Photonic Packaging Engineer to join a well funded start-up that is poised to deliver the world's most efficient optical interconnects, designed from the ground up for AI workloads.
Their cutting-edge technology enables the world's highest density and lowest power photonic interconnects, transforming how data is processed and transmitted in data center environments.
Backed by Tier 1 investors, they are seeking top talent to join their world-class team and drive the future of optical communications.
- Bachelor's or Master's degree in Electrical Engineering, Optics, Photonics, or a related field.
- Extensive experience (5+ years) in photonic packaging, with a proven track record of designing and delivering high-quality packaging solutions for optical interconnects or related devices.
- Experience designing high-volume single-mode optical fiber array attach to Silicon Photonics (i.e. 400G DR4 or 800G DR8 optical pluggables, CPO, wavelength-selective switches (WSS), optical cross-connects)
- Strong expertise in packaging processes, methodologies, and tools.
Any experience with 2D fiber arrays attached to SiPH grating couplers, associated free-space optics is highly beneficial.
They are offering a competitive base salary + a generous equity package and looking to get someone started ASAP, with interviews on going.
Please apply here or contact me at email@example.com to hear more.