Thermal Engineer

LB165
  • $200,000 - $250,000
  • Santa Clara County, CA
  • Permanent

Thermal Engineer – Liquid Cooling

Santa Clara, California, United States (On-site)

On-site | Santa Clara, CA

200-250k base + equity.



I’m working with a well-funded technology company developing high-performance hardware for advanced data-center applications.

They are looking for an experienced Thermal Engineer to lead the design, modeling and validation of cooling systems for high-power electronic equipment.


This is an equipment-level thermal-engineering position rather than a facilities or HVAC role. You’ll own thermal solutions from early analysis and simulation through physical testing and system integration.


You’ll work on:

  • Designing heat sinks, cold plates and liquid-cooling loops
  • Developing advanced air-, liquid- and two-phase-cooling solutions
  • Running thermal modeling and simulation
  • Conducting physical testing, validation and model correlation
  • Integrating cooling systems into broader hardware architectures
  • Troubleshooting thermal-performance and system-reliability issues
  • Working across mechanical, electrical and system-engineering teams
  • Building technical relationships with cooling-component suppliers
  • Evaluating new thermal technologies and industry developments.


Looking for engineers who have:

  • A bachelor’s degree in Mechanical Engineering or a related discipline, with a master’s preferred
  • 10+ years of thermal-design experience
  • At least two years of hands-on liquid- or two-phase-cooling design experience
  • Strong knowledge of heat-transfer fundamentals
  • Proficiency with Flotherm, Flotherm XT, FloEFD, Icepak or equivalent tools
  • Experience taking thermal designs from modeling through physical validation
  • Designed cooling solutions for high-power commercial electronic systems
  • Worked closely with technical suppliers and cross-functional engineering teams.


You should also understand data-center liquid-cooling systems, including:

  • In-chassis cooling loops
  • Rack interfaces and associated hardware
  • In-rack or in-row coolant distribution units
  • Connections between equipment cooling and facility-side infrastructure.



Experience with networking, server, telecom or comparable high-power rack-mounted equipment is particularly relevant.

This is an opportunity to take ownership of technically challenging thermal systems within an experienced team developing next-generation data-center hardware.



Worth a confidential chat?

Anna Button Researcher

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